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SZSE：002741

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中
Product Search

ABOUT US

Brief Introduction
Subsidiary Company
Company Culture
Brand Introduction
Development History
R&D Strength
Qualification & Honor
Organizational Structure
Sustainable Development

Industrial Layout

Electronic Information
Automobile
Energy
Medical Health
Internet

Industry Service

PCB
New Energy Materials
Auto Parts
Photovoltaic
Electronic Components
Medicine
Daily Chemical
Bathroom Hardware
R&D
E-commerce

Products

Investor Relations

Investor Relations
Fair at the side
Interactive Platform
Corporate Governance
Securities Information
Shareholder Returns

Contact Information
Online Message

Circuit Formation

Home > Circuit Formation

Information

Application：

It is used for the removal of inner dry film, outer dry film and ENIG selective dry film during PCB manufacturing, and in particular applicable to the removal of dry film for fine circuit, and applies to the film removal for IC substrate and MSAP process. 。

Advantage introduction：

Free of caustic soda, free of impact on tin surface and solder mask ink;

Free of oxidation on copper surface and gold surface;

Film broken into small particles to prevent wrapping roller and blocking nozzle;

High film removal rate, more than 1x faster than NaOH;

Bath life can be extended more than 10X than NaOH;

Applicable to film removal for IC substrate and MSAP process.